How to solve the cooling problems of LED chip of high-power white LED lights

With a wide range of high-power white LED applications including the COB LED flood light, the cooling problems of LED chip of high-power white LED lights such as COB LED flood light is urgently to solve in the actual life, high heat of LED chip is generated in a very small volume,but the heat capacity of the LED itself of COB LED flood light and other power LED lighting is small, these heat must be conducted as soon as possible otherwise it will have a very high junction temperature. We have been a lot of improvements on the chip of COB LED flood light and other power public LED lighting to leads the heat outside of the chip, the main improvement is the use of better thermal conductivity substrate material on the LED chip structure to improve the heat dissipation of the LED chip of power LED lights particularly the COB LED flood light and other power commercial and industrial LED lighting . because Cree ‘s LED thermal resistance use silicon carbide as the substrate , the thermal resistance is at least twice as low as that of other companies .

COB LED flood light

Even if thermal resistance can be solved from the chip to the package material, but the cooling effect is not good from the package to the PCB board, which cause that the temperature of LED chip of COB LED flood light and other power LED light rises, the phenomenon appears luminous efficiency decreases . So, just as the Panasonic want to solve this problem , the circular , linear, surface -type white LED, and PCB board have been designed into one since 2005 to overcome the heat problem because of the interruption emergence from the package to the PCB board .

Thus , in the face of constantly improving the current situation , while how to increase the heat capacity of the chip of COB LED flood light and other power LED lights is urgent to be overcome at this stage, in addition to the material itself, but also including the wafer and the heat resistance of the packaging material , heat resistance thermal structure, thermal structure between the packaging materials and the PCB board and the thermal structure of PCB , all of which of COB LED flood light and other power LED lights needs to be holistic considerations.Browsing http://www.lead-lighting.com/products/bid19-1.htm for more information about the COB LED flood light.

Article from http://www.lighting-ledlight.com/index.php/how-to-solve-the-cooling-problems-of-led-chip-of-high-power-white-led-lights-such-as-cob-led-flood-light/

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